Introduction PLCFA - diffusion furnace The application of the M3 method

= of PLC Programmable Logic Controller, Programmable Logic Controller, a digital computing operation of electronic systems, specially designed for applications in industrial environment. It USES a programmable memory for its internal storage procedures, to perform the logic operation, sequence control, timing, counting and arithmetic operations such as user-oriented instructions, and through the digital or analog input/output control various types of machinery or production process. Is the core part of industrial control.

PLC controller FA - yokogawa The M3 in the application of diffusion furnace. The diffusion furnace working range ( From 800 to 1000 mm) Generally need - 01 ℃ ( Individual requirements + 0. 5℃） 。 Diffusion furnace is one of the important technological equipment of integrated circuit production line process, its main purpose is to doped semiconductor, namely under the condition of high temperature to diffusion into the silicon doped materials, so as to change and control the type, concentration and distribution of impurity in the semiconductor, in order to establish the electrical characteristics of different regions. Although some processes can use the method of ion implantation doping, but the thermal diffusion is one of the main and the most common method of doping. Thermal oxidation of silicon is to make silicon wafer surface react with oxidant at high temperature, a layer of silicon dioxide film growth. Oxidation method with dry oxygen oxidation and water vapor oxidation ( The hydroxide synthesis) Two kinds, diffusion furnace is prepared by the two methods of oxide oxidation layer, a necessary equipment. Is the foundation of semiconductor integrated circuit technology diffusion furnace equipment, it has to do with semiconductor technology interdependence, mutual promotion and common development.

diffusion furnace working range ( From 800 to 1000 mm) Generally need - 01 ℃ ( Individual requirements + 0. 5℃） 。 In most cases only use outside temperature control, temperature in test data (only in 分析) And 2 - Correction of 3 times on Monday. Different chip and the number of requirements in relative outside temperature value given by profiling. When using the temperature, the use of cascade control, the temperature output used as outside temperature set point.

control difficulties:

1: the precision of temperature. + 0. 1 degree requires considerable control technology ( The PID parameters) Accumulation. :

2 degrees of freedom. The target value of multiple sets of data to be stored and switch freely. To avoid interference.

3: heating wire break early warning; Usually using CT monitoring current, voltage monitoring. Have used to monitor the same condition of output change ( Such as increased from 60% to 70%) To judge the aging degree of warning is given.

FA - M3 applicable module:

heating furnace temperature control -- -- -- -- -- F3CU04 - 1 s:

200 ms cycle, 0. Article 1 degree of high precision control, temperature control curve number is not restricted.

temperature control of a single system being up to 144 loop control, the installation space, can save much more flexible control, convenient networking extension.

each point being is independent, don't need to add gelizha, reduce the interference between the heating wire.

is due to the modular, no longer need the tedious communication between PLC and temperature regulator programming and wiring.

using dedicated software advances confidently setting PID/testing/monitoring. Don't have to use recorder aided. Multi-channel figure color monitor provides convenient for debugging. Other -- -- -- -- --

Bolt testing and e - RT3 intelligence CPU

the lower limit of elec tric current, disconnection alarm.

compensation voltage changes, in order to prevent false alarm.

☆e - RT real-time system CPU to complete the master and the temperature control process, instead of traditional PC, the system more stable.

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